Feed-through assembly

ABSTRACT

A feed-through assembly is presented. The feed-through assembly includes a first end and a second end with a body therebetween. The first end comprises a substantially L-shaped end and a block. The substantially L-shaped end includes a first contact surface. The block includes a second contact surface.

FIELD OF THE INVENTION

The present invention relates generally to an electronic device and, more particularly, to a feed-through assembly in an electronic device.

BACKGROUND OF THE INVENTION

Numerous devices (e.g., implantable medical devices (IMDs) electrochemical cells, sensors etc.) are hermetically sealed. Hermetically sealed containers prevent liquid from contacting electronic components within a device. To connect with the electronic components, a feed-through assembly is inserted into a portion of the housing.

A typical feed-through assembly consists of a conductive element (e.g., wires etc.), a ferrule, an insulator member (e.g. glass, ceramic etc.), and a seal. The ferrule includes an aperture configured to receive the insulator member. A seal is located between the ferrule and the insulator member. An eyelet, slipped over the conductive element, is seated into the insulator member.

Electronic devices and feed-through assemblies are typically designed so that a perpendicular bonding orientation exists therebetween. A perpendicular bonding orientation is defined by the conductive element (e.g. wire) being perpendicular to a planar portion (e.g. bottom, side wall etc.) of the housing for the electronic device. Perpendicular bonding orientation may not be used with some electronic components. It is therefore desirable to have a feed-through assembly that overcomes this limitation.

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention will become more fully understood from the detailed description and the accompanying drawings, wherein:

FIG. 1 is a perspective cutaway view of a housing with a feed-through assembly placed therethrough;

FIG. 2 is a perspective cutaway view of a housing with a plurality of feed-through assemblies placed therethrough;

FIG. 3 is a perspective angled view of an exemplary feed-through assembly oriented in a vertical position;

FIG. 4 is a perspective angled view of an exemplary feed-through assembly oriented in a horizontal position;

FIG. 5 is an angled perspective view of a first end of an exemplary feed-through assembly;

FIG. 6 is an angled perspective view of a portion of a first end of an exemplary feed-through assembly without insulating material and a block;

FIG. 7 is an angled perspective view of an exemplary feed-through assembly coupled to an electronic component;

FIG. 8 is a top perspective view a feed-through assembly that includes a capacitor; and

FIG. 9 is flow diagram for connecting a feed-through assembly with an electronic component.

DETAILED DESCRIPTION OF THE EMBODIMENTS

The following description of an embodiment is merely exemplary in nature and is in no way intended to limit the invention, its application, or uses. For purposes of clarity, similar reference numbers are used in the drawings to identify similar elements.

The present invention is directed to a feed-through assembly for a sensor associated with an implantable medical device. A feed-through assembly includes a substantially cylindrically shaped body with a first end and a second end. The first end comprises a substantially L-shaped end and a block. The L-shaped end includes a first contact surface. The block, coupled to the L-shaped end, includes a second contact surface. The feed-through assembly is inserted through a portion of the housing or shield such that the first and second contact surfaces are adjacent to first and second conductive elements (e.g. pins, posts, blocks, pads etc.) of an electronic component. In this configuration, multiple orientations are possible via an interconnect between the first and second contact surfaces and the first and second pins, respectively. For example, the conductive element (e.g. wire etc.), defined as the axis of the feed-through assembly, can be horizontally or vertically-oriented relative to a planar portion of the housing, shield, or printed wiring board.

Additionally, multiple conductive elements (e.g. pins, wires, etc.) from an electronic component may be placed adjacent to each other that are bondable by automated methods (e.g. wirebond, laser ribbon welding, laser wire welding, soldered wire, soldered ribbon, laser welded flex circuit, soldered flex circuit, resistance spot welding, tape automated bonding (TAB), etc.). Moreover, the first and second contact surfaces on the feed-through assembly provide mechanically stable platforms for wirebond interconnect or other interconnect methods. Furthermore, an integrated filter capacitor can be included in the feed-through assembly in which capacitance can be varied by selection of insulating material or by varying geometric factors (e.g. area of an interface and/or gap between signal and ground pins).

Referring now to FIG. 1, an exemplary electronic component such as a capacitor 10 for an implantable medical device (IMD) is depicted. Capacitor 10 includes a housing 12, an electrode stack 14, an inner liner 18, an outer liner 16, a fill port 15 (also referred to as a tube), and a feed-through assembly 20. Housing 12 is formed by a first portion 13 a welded to a second portion 13 b. Housing 12 also includes apertures 17, 19 in which fill port 15 and feed-through assembly 20 are coupled thereto, respectively. Inner and outer liners 18, 16 surround electrode stack 14 to prevent direct contact between electrode stack 14 and housing 12.

FIG. 2 depicts first portion 13 a of housing 12. First portion 13 a includes a bottom 21 and a circumferential side 24. A first and a second set of feed-through assemblies 23 a, 23 b are inserted through bottom 21 and side 24, respectively. First set of feed-through assemblies 23 a in bottom 21 are oriented in a vertical direction, as shown in FIGS. 2 and 3. The vertical orientation is defined by an axis formed by first and second ends 25 a, 25 b of conductive element 22 (e.g. wire, etc.) oriented perpendicular to bottom 21. In contrast, feed-through assembly 23 b is oriented in a horizontal direction along side 24 by first and second ends 25 a, 25 b being parallel to bottom 21, as shown in FIGS. 2 and 4.

FIGS. 5 and 6 depict details of feed-through assembly 20 that allow different orientations (i.e. vertical orientation and horizontal orientation) to occur between feed-through assembly 20 and first portion 13 a. Feed-through assembly 20 includes a first end 26 a (ghost lines) and a second end 26 b with a substantially cylindrically shaped body 28 therebetween. Body 28 has a diameter of about 0.130 inches and is comprised of a metallic material.

First end 26 a comprises a substantially L-shaped end 30, conductive element 22, insulating material 32, and block 34. Substantially L-shaped end 30 includes a first length (L1), a second length (L2), a height (H1), and a first contact surface 36. L1 ranges from about 0.035 to about 0.069 inches; L2 ranges from about 0.015 to about 0.037 inches; and H1 ranges from about 0.015 to about 0.037 inches. The width (W1) of first contact surface 36 ranges from about 0.015 to about 0.023 inches.

Insulating material 32 is disposed between L-shaped end 30 and block 34. Insulating material 32 may comprise epoxy and hardener, polyimide, ceramic with an adhesive film or other suitable material.

Block 34, coupled to the substantially L-shaped first end 30, includes a second contact surface 38. Block 34 is defined by length (L3), height (H2) and radial aperture portion R. L3 ranges from about 0.015 inches to about 0.047 inches and H2 ranges from about 0.020 inches to about 0.033 inches. Radial aperture portion is configured to receive conductive element 22. R ranges from about 0.006 to about 0.009 inches. The width (W2) of second contact surface 38 ranges from about 0.015 to about 0.023 inches. Skilled artisans appreciate that these dimensions may be increased or decreased depending upon the size of feed-thorough assembly 20.

FIG. 7 depicts feed-through assembly 20 mounted in a horizontal orientation to a housing 100. In this embodiment, housing 100 relates to a different electronic component such as a sensor used in conjunction with implantable medical devices. An example of such a sensor may be seen with respect to U.S. patent application Ser. No. 10/733,000, and assigned to the assignee of the present invention, the disclosure of which is incorporated by reference in relevant parts.

Housing 100 includes first and second pins 42 and 44, respectively. First pin 42 is a ground pin and second pin 44 is a center pin or signal pin. First pin 42 is coupled to first contact surface 36 via interconnect 40 a while second pin is coupled to second contact surface 38 via interconnect 40 b. Interconnect 40 a, 40 b may be formed by wirebonding, laser ribbon welding, laser wire welding, soldered wire, soldered ribbon, laser welded flex circuit, soldered flex circuit, resistance spot welding, or TAB bonding. Interconnect 40 a, 40 b comprise conductive material such as nickel clad copper, aluminum, gold, copper, nickel, tungsten, tantalum, titanium, or other suitable material.

FIG. 8 depicts another embodiment of a filtered feed-through assembly 20 that includes a capacitor 50. Capacitance on capacitor 50 may be modified to meet requirements specified by electronic components.

FIG. 9 is a flow diagram that depicts formation of an IMD that includes feed-through assembly 20. At operation 200, a housing is provided. An electronic component is placed within the housing at operation 210. A feed-through assembly is coupled to the housing at operation 220. The feed-through assembly includes a first end and a second end with a body therebetween. The first end includes a first contact surface and a second contact surface. At operation 230, a first interconnect is coupled to a first pin of the electronic component and the first contact surface of the feed-through assembly. At operation 240, a second interconnect is coupled to a second pin of the electronic component and the second contact surface of the feed-through assembly.

The present invention has numerous applications. For example, while the figures relate to unipolar feed-through assemblies, other types of feed-through assemblies (quadripolar feed-through assemblies etc.) may also rely on this process to reliably produce quality feed-through assemblies. Skilled artisans also appreciate that while feed-through assembly 20 is used relative to sensor housing 100, feed-through assembly may be used in a variety of other electronic components (e.g. commercial or military electronic packaging, optoelectronic packaging, telecommunications etc). Additionally, while the first and second contact surfaces are depicted as flat surfaces, first and second contact surfaces may also have substantially rounded edges. The description of the invention is merely exemplary in nature and, thus, variations that do not depart from the gist of the invention are intended to be within the scope of the invention. Such variations are not to be regarded as a departure from the spirit and scope of the invention. 

1. An implantable medical device (IMD) comprising: a housing; an electronic component disposed within the housing and having first and second conductive elements; a feed-through assembly inserted through a wall of the housing, the feed-through assembly including a body having a first end positioned inside the housing and a second end positioned outside the housing, an elongated conductive element carried within and extending through the body, wherein a first end of the elongated conductive element is located inside the housing and the second end of the elongated conductive element is located outside of the housing, wherein the elongated conductive element defines an axis extending between the first end and the second end of the elongated conductive element, a first conductive block located inside the housing proximate the first end of the body, the first conductive block comprising a substantially L-shaped body providing a first contact surface located within the housing, a second conductive block located inside the housing proximate the first end of the body, the second conductive block nested within the substantially L-shaped body of the first conductive block, the second conductive block providing a second contact surface located within the housing, insulating material disposed between the first conductive block and the second conductive block, wherein a portion of the elongated conductive element is positioned between the first conductive block and the second conductive block, and wherein the insulating material is located between and in direct contact with the first conductive block and the portion of the elongated conductive element positioned between the first conductive block and the second conductive block, wherein the second conductive block comprises a radial aperture portion facing the first conductive block, wherein the elongated conductive element is located between the first conductive block and the radial aperture portion of the second conductive block, wherein the first conductive block is electrically connected to the first conductive element of the electronic component by a first interconnect extending between the first contact surface and the first conductive element, and wherein the second conductive block is electrically connected to the second conductive element of the electronic component by a second interconnect extending between the second contact surface and the second conductive element.
 2. The IMD of claim 1 wherein the first and second conductive elements of the electronic component comprise a first pin and a second pin, the first contact surface being coupled to the first pin.
 3. The IMD of claim 2 wherein the second pin is coupled to the second contact surface.
 4. The IMD of claim 3 wherein the first pin serves as a ground pin and the second pin serves as a signal pin.
 5. The IMD of claim 1 wherein the first interconnect is selected from a group consisting of: a laser ribbon bond, thermosonic/ultrasonic wirebond, laser wire weld interconnect, a soldered wire, a soldered ribbon, a laser weld flex circuit, a soldered flex circuit, a resistance spot weld, a tape automated bonding (TAB) bond.
 6. The IMD of claim 3 wherein the electronic component is a sensor.
 7. The IMD of claim 1 wherein the housing comprises a bottom wall and a side wall, and wherein the feed-through assembly extends through the side wall of the housing, and wherein the first contact surface and the second contact surface are horizontally oriented relative the bottom wall of the housing.
 8. The IMD of claim 1 wherein the housing comprises a bottom wall and a side wall, and wherein the feed-through assembly extends through the bottom wall of the housing, and wherein the first contact surface and the second contact surface are vertically oriented relative the bottom wall of the housing.
 9. The IMD of claim 1 wherein the first contact surface and the second contact surface are flat surfaces.
 10. The IMD of claim 1 wherein the first contact surface and the second contact surface are adjacent to the first and second conductive elements of the electronic component.
 11. The IMD of claim 1 wherein the first contact surface comprises a flat surface and the first conductive element of the electronic component comprises a flat surface, and wherein the flat surface of the first contact surface and the flat surface of the first conductive element face that same direction, and wherein the first interconnect is attached to the flat surface of the first contact surface and the flat surface of the first conductive element; and further wherein the second contact surface comprises a flat surface and the second conductive element of the electronic component comprises a flat surface, and wherein the flat surface of the second contact surface and the flat surface of the second conductive element face that same direction, and wherein the second interconnect is attached to the flat surface of the second contact surface and the flat surface of the second conductive element.
 12. The IMD of claim 1, wherein the first conductive element of the electronic component comprises a ground pin such that the first conductive block is electrically connected to ground through the ground pin, and second conductive element of the electronic component comprises a signal pin such that second conductive block and the elongated conductive element extending through the body of the feedthrough assembly are connected to a signal passing through the signal pin from the electronic component.
 13. An implantable medical device (IMD) comprising: a housing; an electronic component disposed within the housing and having first and second conductive elements; a feed-through assembly inserted through a wall of the housing, the feed-through assembly including a body having a first end positioned inside the housing and a second end positioned outside the housing, an elongated conductive element carried within and extending through the body, wherein a first end of the elongated conductive element is located inside the housing and the second end of the elongated conductive element is located outside of the housing, wherein the elongated conductive element defines an axis extending between the first end and the second end of the elongated conductive element, a first conductive block located inside the housing proximate the first end of the body, the first conductive block comprising a substantially L-shaped body providing a first contact surface located within the housing, a second conductive block located inside the housing proximate the first end of the body, the second conductive block nested within the substantially L-shaped body of the first conductive block, the second conductive block providing a second contact surface located within the housing, wherein the second conductive block comprises a radial aperture portion facing the first conductive block, wherein the elongated conductive element is located between the first conductive block and the radial aperture portion of the second conductive block, insulating material disposed between the first conductive block and the second conductive block, wherein a portion of the elongated conductive element is positioned between the first conductive block and the second conductive block, and wherein the insulating material is located between and in direct contact with the first conductive block and the portion of the elongated conductive element positioned between the first conductive block and the second conductive block, wherein the first conductive block is electrically connected to the first conductive element of the electronic component by a first interconnect extending between the first contact surface and the first conductive element, wherein the second conductive block is electrically connected to the second conductive element of the electronic component by a second interconnect extending between the second contact surface and the second conductive element, wherein the housing comprises a bottom wall and a side wall, and wherein the feed-through assembly extends through the side wall of the housing, and wherein the first contact surface and the second contact surface are horizontally oriented relative the bottom wall of the housing.
 14. The IMD of claim 13 wherein the first contact surface and the second contact surface are flat surfaces.
 15. The IMD of claim 13 wherein the first contact surface and the second contact surface are adjacent to the first and second conductive elements of the electronic component.
 16. The IMD of claim 13 wherein the first contact surface comprises a flat surface and the first conductive element of the electronic component comprises a flat surface, and wherein the flat surface of the first contact surface and the flat surface of the first conductive element face that same direction, and wherein the first interconnect is attached to the flat surface of the first contact surface and the flat surface of the first conductive element; and further wherein the second contact surface comprises a flat surface and the second conductive element of the electronic component comprises a flat surface, and wherein the flat surface of the second contact surface and the flat surface of the second conductive element face that same direction, and wherein the second interconnect is attached to the flat surface of the second contact surface and the flat surface of the second conductive element.
 17. The IMD of claim 13, wherein the first conductive element of the electronic component comprises a ground pin such that the first conductive block is electrically connected to ground through the ground pin, and second conductive element of the electronic component comprises a signal pin such that second conductive block and the elongated conductive element extending through the body of the feedthrough assembly are connected to a signal passing through the signal pin from the electronic component.
 18. An implantable medical device (IMD) comprising: a housing; an electronic component comprising a sensor disposed within the housing and having first and second conductive elements; a feed-through assembly inserted through a wall of the housing, the feed-through assembly including a body having a first end positioned inside the housing and a second end positioned outside the housing, an elongated conductive element carried within and extending through the body, wherein a first end of the elongated conductive element is located inside the housing and the second end of the elongated conductive element is located outside of the housing, wherein the elongated conductive element defines an axis extending between the first end and the second end of the elongated conductive element, a first conductive block located inside the housing proximate the first end of the body, the first conductive block comprising a substantially L-shaped body providing a first contact surface located within the housing, a second conductive block located inside the housing proximate the first end of the body, the second conductive block nested within the substantially L-shaped body of the first conductive block, the second conductive block providing a second contact surface located within the housing, wherein the second conductive block comprises a radial aperture portion facing the first conductive block, wherein the elongated conductive element is located between the first conductive block and the radial aperture portion of the second conductive block, insulating material disposed between the first conductive block and the second conductive block, wherein a portion of the elongated conductive element is positioned between the first conductive block and the second conductive block, and wherein the insulating material is located between and in direct contact with the first conductive block and the portion of the elongated conductive element positioned between the first conductive block and the second conductive block, wherein the first conductive block is electrically connected to the first conductive element of the electronic component by a first interconnect extending between the first contact surface and the first conductive element, wherein the second conductive block is electrically connected to the second conductive element of the electronic component by a second interconnect extending between the second contact surface and the second conductive element, wherein the housing comprises a bottom wall and a side wall, and wherein the feed-through assembly extends through the bottom wall of the housing, and wherein the first contact surface and the second contact surface are vertically oriented relative the bottom wall of the housing.
 19. The IMD of claim 18 wherein the first contact surface and the second contact surface are flat surfaces.
 20. The IMD of claim 18 wherein the first contact surface and the second contact surface are adjacent to the first and second conductive elements of the electronic component.
 21. The IMD of claim 18 wherein the first contact surface comprises a flat surface and the first conductive element of the electronic component comprises a flat surface, and wherein the flat surface of the first contact surface and the flat surface of the first conductive element face that same direction, and wherein the first interconnect is attached to the flat surface of the first contact surface and the flat surface of the first conductive element; and further wherein the second contact surface comprises a flat surface and the second conductive element of the electronic component comprises a flat surface, and wherein the flat surface of the second contact surface and the flat surface of the second conductive element face that same direction, and wherein the second interconnect is attached to the flat surface of the second contact surface and the flat surface of the second conductive element.
 22. The IMD of claim 18, wherein the first conductive element of the electronic component comprises a ground pin such that the first conductive block is electrically connected to ground through the ground pin, and second conductive element of the electronic component comprises a signal pin such that second conductive block and the elongated conductive element extending through the body of the feedthrough assembly are connected to a signal passing through the signal pin from the electronic component. 